As we know Qualcomm Bluetooth audio chip include CSR series (CSR8635, CSR8645, CSR8670, CSR8675 etc.), and QCC series (QCC3021, QCC3024, QCC3031, QCC3034, QCC5124, QCC5125 etc.).CSR series chips are old product, QCC series chips are new product. Actually, like CSR8670, QCC30XX and QCC5XXX, there is not much difference in Bluetooth version and audio decoding, they are all Bluetooth 5.0+aptx, and also support CVC call noise reduction.
CSR8670 is an old part number that existed before Qualcomm acquired CSR. It is a high-performance Bluetooth audio chip. Although the hardware supports 5.0, most of the Bluetooth headsets and Bluetooth speaker devices used for design use Bluetooth 3.0, Bluetooth 4.1, and Bluetooth 4.2 versions, which are slightly inferior in stability and delay.
QCC30XX series include many part numbers, such as: QCC3020, QCC3024, QCC3026, etc. It is the first chip to support TWS plus, which is widely known in the True wireless earphone. The functions of these three models are not very different, but the packaging process is different. The former is VFBGA package, the latter QCC3026 is a WLCSP package.
QCC51XX series includes QCC5121, QCC5124, QCC5125, QCC5126, etc. It is Qualcomm's high-end series of Bluetooth, positioning the flagship, and the price is relatively expensive. QCC51XX adopts quad-core design (dual CPU + dual DSP). Thanks to dual DSP, it can support multi-level active noise reduction and wake up artificial intelligence voice assistant function. This is what other series of chips do not have. Other series of chips are single-core DSP, which only provides simple EQ adjustment and DRC, and microphone CVC noise reduction. The power consumption of the QCC51XX is also further reduced, which means longer battery life for audio devices.
Following as HYXKIOT’s Bluetooth audio module based on Qualcomm chips selection chart: