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Comprehensive analysis of major Bluetooth chips

Release date:2022-2-15 15:49:13

1. Qualcomm 

Qualcomm mainly supply Bluetooth audio chips.

QCC5100 series: including QCC5120 and QCC5121, both of which are Bluetooth 5.0 versions, dual-mode Bluetooth.

QCC300x series: QCC3001, QCC3002, QCC3003, QCC3004, QCC3005 are used for Bluetooth headset applications, and QCC3006, QCC3007, QCC3008 are used for Bluetooth speaker applications. All parts are Bluetooth 5.0 version, dual-mode Bluetooth.

QCA4024 SoC is a dual-die system-on-chip that supports Bluetooth 5.0 and 802.15.4-based technologies, including Zigbee and Thread.

QCA4020 SoC is a three-mode system-on-a-chip that supports dual-band WIFI and is based on Bluetooth 5.0 and 802.15.4 technologies, including Zigbee and Thread.

CSRB53xx series: including CSRB5341, CSRB5342, CSRB5348, all parts are Bluetooth 4.1 version, dual-mode Bluetooth.

CSRA68100: A Bluetooth audio platform that enables innovation and functional differentiation at the top end of the Bluetooth speaker and headset market. It has 4 times more DSP processing power than the previous advanced Bluetooth SoC CSR8675, and has advanced features on a single-chip platform, supporting the development of portable wireless speakers and headphones with superior audio quality, voice control, far-field echo cancellation, sensor processing and audio post-processing. Bluetooth 5.0 version.

CSRA65700: Subwoofer ROM solution, Bluetooth version 4.0.

CSR8811 Chipset: Bluetooth v4.1 single-chip radio and baseband IC for consumer electronic devices. Bluetooth low energy, CSRmesh technology, dual-mode Bluetooth.

CSR86xx series: including CSR8605, CSR8610, CSR8615, CSR8620, CSR8630, CSR8635, CSR8645, these are Bluetooth 4.1 versions, CSR8670, CSR8675 are Bluetooth 5.0 versions.

CSR8510 Bluetooth version 4.0, dual-mode Bluetooth.

Both CSR8350 and CSR835A are Bluetooth 4.1 version, dual-mode Bluetooth.

CSR8311 Bluetooth version 4.1, dual-mode Bluetooth.

CSR102x series: including CSR1020, CSR1021, CSR1024, CSR1025 are all Bluetooth version 4.2, support Bluetooth low energy CSRmesh technology, CSR102x chipset product series is optimized for specific applications in the Internet of Things, including wireless remote control, simple smart watch, Home automation solutions and beacons where balancing performance, battery life and price point is critical.

CSR101x series: including CSR1010, CSR1011, CSR1012, CSR1013 are Bluetooth 4.1 version, support Bluetooth low energy CSRmesh technology, single-chip Qualcomm Bluetooth low energy radio with integrated microprocessor and enhanced memory, can provide excellent application flexibility.

 

Advantages and disadvantages:

Qualcomm focuses on Bluetooth audio data transmission, GUI development is simple and easy to use, and the BLE part is not much developed. It is the first to propose a private BLE MSEH manufacturer.

 

2.       TI


TI focused on BLE chips.

CC2642R: Bluetooth 5.0 version.

CC2652R: Bluetooth version 5.0, Bluetooth, Zigbee, Thread, 2.4 GHz proprietary.

CC2640R2F-Q1: Automotive compliant SimpleLink Bluetooth low energy wireless MCU, Bluetooth version 5.0.

CC2640R2F: SimpleLink Bluetooth low energy wireless MCU, Bluetooth version 5.0.

CC2564C: Dual-mode Bluetooth controller in mrQFN package, classic Bluetooth, dual-mode Bluetooth, Bluetooth 4.2.

CC2640: SimpleLink ultra-low power wireless MCU for Bluetooth Smart applications, Bluetooth 4.2.

CC2540T: 2.4GHz Bluetooth Low Energy wireless MCU.

CC2541: Wireless MCU, Bluetooth 4.0.

CC2564: Bluetooth Smart Ready Controller, Smart RF Transceiver, Bluetooth Smart (Bluetooth Low Energy), Classic Bluetooth, Dual Mode Bluetooth.

CC2540: SimpleLink Bluetooth Smart Wireless MCU with USB, Bluetooth Smart (Bluetooth Low Energy).

CC2560: Bluetooth Smart Ready Controller, Smart RF Transceiver.

 

Advantages and disadvantages:

The first BLE Bluetooth chip manufacturer, complete development materials, many reference designs, stable product performance, good technical support, the first mass-produced Bluetooth 5.0 chip on the market, the disadvantage is that TI RTOS is not easy to use, Flash, RAM is a bit small .

 

3.       Nordic


Nordic is an Ultra low power (ULP) radio frequency (RF) professional manufacturer

nRF52840: Multiprotocol Bluetooth 5.0/Bluetooth Low Energy/ANT/802.15.4/2.4GHz RF SoC.

nRF52832: Multiprotocol Bluetooth 5.0/Bluetooth Low Energy/ANT/2.4GHz SoC.

nRF52810: Multiprotocol Bluetooth 5.0/Bluetooth Low Energy/ANT/2.4GHz SoC.

nRF51822: Bluetooth low energy and 2.4GHz proprietary multi-protocol SoC.

nRF51824: Automotive-grade Bluetooth Low Energy SoC.

nRF51422: ANT and ANT/Bluetooth Low Energy Multiprotocol SoC.

The software framework is not good, and the logic of the application layer is not clear, but the products are rich and the data is complete.

 

4.       Dialog


Dialog mainly supply power management, audio, short-range wireless technology, touch, display, etc.

DA14580: Selected by Xiaomi bracelet. The DA14580 is the world's smallest, lowest power, and highest integrated Bluetooth Smart SoC.

DA14681: M4 core, large Flash, large RAM

DA14585: Bluetooth Low Energy 5.0

DA14531: the world’s smallest and lowest power Bluetooth 5.1 System-on-Chip.

Advantages and disadvantages: Software development is difficult, products are cheap, and power consumption is ultra low.

5.       Beken


Beken supply both audio and data chips.

BK3431: It is a highly integrated Bluetooth 4.0 low-power single-mode device. It integrates high-performance RF transceiver, baseband, ARM core microprocessor, rich functional peripheral units, programmable protocols and profiles to support BLE applications. Flash program memory makes it suitable for custom applications.

BK3231: It is a highly integrated single-chip Bluetooth3.0HID device. It integrates high-performance transceivers, feature-rich baseband processors and Bluetooth HID profiles. The FLASH program memory makes it suitable for custom applications, but also for other Bluetooth applications such as SPP controllers.

BK3260: It is a Bluetooth 4.0 dual-mode audio device that integrates a 14443-A NFC card. It integrates an RF transceiver, feature-rich baseband processor, FLASH memory controller, multiple analog and digital peripherals, and a Bluetooth software stack including audio and hands-free profiles.

BK3254: It is a highly integrated single-chip Bluetooth 4.1 multimedia device. It integrates a Bluetooth transceiver, FM receiver, SD card interface, USB OTG and high-performance audio peripherals. The BK3254 cache based architecture makes it fully programmable in any application for control and multimedia mixing applications.

BK8000: It is a highly integrated Bluetooth 2.1+EDR audio single chip. The chip integrates a high-performance Bluetooth transceiver, a multi-function baseband processor and a Bluetooth audio protocol.

BK3252: It is a highly integrated single-chip Bluetooth 2.1+EDR multimedia device. The chip integrates a Bluetooth transceiver, FM receiver and high-performance audio peripherals.

BK3266: BK3266 is a low-power, highly integrated Bluetooth audio chip (SoC) audio device.

BK8002: It is a highly integrated single-chip Bluetooth 2.1+EDR multimedia device. The chip integrates a Bluetooth transceiver, FM receiver and high-performance audio peripherals.

BK8000L: It is a highly integrated Bluetooth 2.1+EDR audio single chip. The chip integrates a high-performance Bluetooth transceiver, a multi-function baseband processor and a Bluetooth audio protocol.

Advantages and disadvantages: A very good 2.4G Chinese semiconductor manufacturer, BLE has a complete solution to provide, the official website information is based on the AMR9 platform, the detailed data such as power consumption is unknown.

 

6.       Realtek


Main business: Design, test and sell various types of application integrated circuits, the main products are Communications Network ICs, Computer Peripheral ICs, Multimedia ICs, etc.

RTL8762A: Bluetooth Low Energy SOC

RTL8761ATV: Bluetooth 2.1/3.0/4.0 controller, UART interface

RTL8761AUV: Bluetooth 2.1/3.0/4.0 controller, USB interface

Advantages and disadvantages: The market share of the remote control is good, and it has in-depth cooperation with iFLYTEK.

 

Shenzhen Huayang Xinke Electronics Co., Ltd is a professional Bluetooth solution provider.Bluetooth modules mainly adopted Qualcomm,TI, Beken, Nordic,Dialog etc. chips. Our R&D department supply free technology supports, and customization also available.

 

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